Surface Treatment of Glass

Glass wafer, as highly promising material for threedimensional (3D) integration applications, its surface treatment and bonding technologies play critical roles in microsystem packaging and 3D integration to enhance
the performance of semiconductor devices.

So a variety of surface treatment and bonding techniques are utilized for glass substrates to meet the diverse requirements.

The main target of glass surface treatment is to remove contaminants or other other cover layers to increase surface activity, gettability, adhesion ability and coating or bonding ability. Comparing other common methods, wet blasting can achieve an excellent balance between the desired surface function and preserving the structural integrity of the glass. It is the top choice to give the glass the controlled roughness for superior adhesion before coating. Before